Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6632314 | Method of making a lamination and surface planarization for multilayer thin film interconnect | RongQing Yu, Chandrika Prasad, Sung Kwon Kang, Sampath Purushothaman | 2003-10-14 |