Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6646355 | Structure comprising beam leads bonded with electrically conductive adhesive | Sampath Purushothaman | 2003-11-11 |
| 6632314 | Method of making a lamination and surface planarization for multilayer thin film interconnect | RongQing Yu, Kimberley A. Kelly, Chandrika Prasad, Sampath Purushothaman | 2003-10-14 |
| 6600224 | Thin film attachment to laminate using a dendritic interconnection | Donald S. Farquhar, Raymond T. Galasco, Mark D. Poliks, Chandrika Prasad, Roy Yu | 2003-07-29 |
| 6555762 | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | Bernd Karl Appelt, Jeffrey D. Gelorme, Voya R. Markovich, Kostas Papathomas, Sampath Purushothaman | 2003-04-29 |
| 6551931 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Daniel C. Edelstein, Maurice McGlashan-Powell, Eugene J. O'Sullivan, George F. Walker | 2003-04-22 |