Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Donald S. Farquhar, Konstantinos I. Papathomas | 2003-11-11 |
| 6613413 | Porous power and ground planes for reduced PCB delamination and better reliability | Robert M. Japp | 2003-09-02 |
| 6600224 | Thin film attachment to laminate using a dendritic interconnection | Donald S. Farquhar, Raymond T. Galasco, Sung Kwon Kang, Chandrika Prasad, Roy Yu | 2003-07-29 |
| 6581280 | Method for filling high aspect ratio via holes in electronic substrates | Brian E. Curcio, Peter A. Gruber, Frederic Maurer, Konstantinos I. Papathomas | 2003-06-24 |
| 6534160 | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Donald S. Farquhar, Konstantinos I. Papathomas | 2003-03-18 |
| 6534179 | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use | Robert M. Japp, Konstantinos I. Papathomas | 2003-03-18 |