Issued Patents 2003
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660945 | Interconnect structure and method of making same | Christina M. Boyko, Donald S. Farquhar | 2003-12-09 |
| 6645607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Donald S. Farquhar, Mark D. Poliks | 2003-11-11 |
| 6599833 | Method and article for filling apertures in a high performance electronic substrate | Donald S. Farquhar | 2003-07-29 |
| 6593534 | Printed wiring board structure with z-axis interconnections | Gerald W. Jones, John M. Lauffer, Voya R. Markovich, Thomas R. Miller, James P. Paoletti +1 more | 2003-07-15 |
| 6589639 | Hole fill composition and method for filling holes in a substrate | Donald S. Farquhar | 2003-07-08 |
| 6581280 | Method for filling high aspect ratio via holes in electronic substrates | Brian E. Curcio, Peter A. Gruber, Frederic Maurer, Mark D. Poliks | 2003-06-24 |
| 6570261 | Method and apparatus for injection molded flip chip encapsulation | Donald S. Farquhar, Michael Joseph Klodowski, James R. Wilcox | 2003-05-27 |
| 6570102 | Structure for high speed printed wiring boards with multiple differential impedance-controlled layer | Thomas R. Miller, Brian E. Curcio, Joseph J. Sniezek | 2003-05-27 |
| 6534245 | Process for filling apertures in a circuit board or chip carrier | Bernd Karl Appelt, Gary Johansson | 2003-03-18 |
| 6534186 | Chip carriers with enhanced wire bondability | Bernd Karl Appelt, John J. Konrad | 2003-03-18 |
| 6534179 | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use | Robert M. Japp, Mark D. Poliks | 2003-03-18 |
| 6534160 | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Donald S. Farquhar, Mark D. Poliks | 2003-03-18 |
| 6524654 | Method of controlling the spread of an adhesive on a circuitized organic substrate | John J. Konrad, John A. Welsh | 2003-02-25 |
| 6504111 | Solid via layer to layer interconnect | Brian E. Curcio, Donald S. Farquhar, Voya R. Markovich | 2003-01-07 |