Issued Patents 2003
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664485 | Full additive process with filled plated through holes | Anilkumar C. Bhatt, Irving Memis, William E. Wilson | 2003-12-16 |
| 6630743 | Copper plated PTH barrels and methods for fabricating | Roy H. Magnuson, Thomas R. Miller, Michael Wozniak | 2003-10-07 |
| 6609296 | Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means | Donald S. Farquhar, Kostas Papathomas, Leonard L. Schmidt | 2003-08-26 |
| 6608757 | Method for making a printed wiring board | Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Subahu D. Desai, John M. Lauffer, Thomas R. Miller | 2003-08-19 |
| 6593534 | Printed wiring board structure with z-axis interconnections | Gerald W. Jones, John M. Lauffer, Thomas R. Miller, James P. Paoletti, Konstantinos I. Papathomas +1 more | 2003-07-15 |
| 6576549 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-06-10 |
| 6569604 | Blind via formation in a photoimageable dielectric material | Anilkumar C. Bhatt, Francis J. Downes, Jr., Robert Lee Lewis, JR. | 2003-05-27 |
| 6559388 | Strain relief for substrates having a low coefficient of thermal expansion | John S. Kresge | 2003-05-06 |
| 6555762 | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | Bernd Karl Appelt, Jeffrey D. Gelorme, Sung Kwon Kang, Kostas Papathomas, Sampath Purushothaman | 2003-04-29 |
| 6547974 | Method of producing fine-line circuit boards using chemical polishing | Stanley M. Albrechta, Christina M. Boyko, Kathleen L. Covert, Natalie B. Feilchenfeld, William E. Wilson +1 more | 2003-04-15 |
| 6545226 | Printed wiring board interposer sub-assembly | William L. Brodsky, Benson Chan, Michael A. Gaynes | 2003-04-08 |
| 6524352 | Method of making a parallel capacitor laminate | Sylvia Adae-Amoakoh, John M. Lauffer, Michael D. Lowell, Joseph J. Sniezek | 2003-02-25 |
| 6521844 | Through hole in a photoimageable dielectric structure with wired and uncured dielectric | Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Peter A. Moschak +2 more | 2003-02-18 |
| 6522014 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-02-18 |
| 6518516 | Multilayered laminate | Kim J. Blackwell, Frank D. Egitto, Manh-Quan Nguyen, Douglas O. Powell, David L. Thomas | 2003-02-11 |
| 6504111 | Solid via layer to layer interconnect | Brian E. Curcio, Donald S. Farquhar, Konstantinos I. Papathomas | 2003-01-07 |