Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6609296 | Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means | Donald S. Farquhar, Voya R. Markovich, Leonard L. Schmidt | 2003-08-26 |
| 6555762 | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | Bernd Karl Appelt, Jeffrey D. Gelorme, Sung Kwon Kang, Voya R. Markovich, Sampath Purushothaman | 2003-04-29 |