Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6555762 | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | Bernd Karl Appelt, Sung Kwon Kang, Voya R. Markovich, Kostas Papathomas, Sampath Purushothaman | 2003-04-29 |