Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6625857 | Method of forming a capacitive element | John M. Lauffer | 2003-09-30 |
| 6574090 | Printed circuit board capacitor structure and method | John M. Lauffer | 2003-06-03 |
| 6555762 | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | Jeffrey D. Gelorme, Sung Kwon Kang, Voya R. Markovich, Kostas Papathomas, Sampath Purushothaman | 2003-04-29 |
| 6534186 | Chip carriers with enhanced wire bondability | Konstantinos I. Papathomas, John J. Konrad | 2003-03-18 |
| 6534245 | Process for filling apertures in a circuit board or chip carrier | Gary Johansson, Konstantinos I. Papathomas | 2003-03-18 |