Issued Patents 2003
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660945 | Interconnect structure and method of making same | Christina M. Boyko, Konstantinos I. Papathomas | 2003-12-09 |
| 6645607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Konstantinos I. Papathomas, Mark D. Poliks | 2003-11-11 |
| 6639155 | High performance packaging platform and method of making same | James R. Bupp, Lisa J. Jimarez | 2003-10-28 |
| 6638607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Lisa J. Jimarez, Keith P. Brodock | 2003-10-28 |
| 6634543 | Method of forming metallic z-interconnects for laminate chip packages and boards | Brian E. Curcio, Elizabeth Foster, Amit K. Sarkhel | 2003-10-21 |
| 6609296 | Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means | Voya R. Markovich, Kostas Papathomas, Leonard L. Schmidt | 2003-08-26 |
| 6599833 | Method and article for filling apertures in a high performance electronic substrate | Konstantinos I. Papathomas | 2003-07-29 |
| 6600224 | Thin film attachment to laminate using a dendritic interconnection | Raymond T. Galasco, Sung Kwon Kang, Mark D. Poliks, Chandrika Prasad, Roy Yu | 2003-07-29 |
| 6589639 | Hole fill composition and method for filling holes in a substrate | Konstantinos I. Papathomas | 2003-07-08 |
| 6570261 | Method and apparatus for injection molded flip chip encapsulation | Michael Joseph Klodowski, Konstantinos I. Papathomas, James R. Wilcox | 2003-05-27 |
| 6552263 | Method of injection molded flip chip encapsulation | Kostantinos Papathomas | 2003-04-22 |
| 6534724 | Enhanced design and process for a conductive adhesive | Gerard Paul Kohut, Andrew Seman, Michael Joseph Klodowski | 2003-03-18 |
| 6534160 | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Konstantinos I. Papathomas, Mark D. Poliks | 2003-03-18 |
| 6504111 | Solid via layer to layer interconnect | Brian E. Curcio, Voya R. Markovich, Konstantinos I. Papathomas | 2003-01-07 |
| 6503821 | Integrated circuit chip carrier assembly | Lisa J. Jimarez, Michael Joseph Klodowski, Jeffrey Zimmerman | 2003-01-07 |