Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6634543 | Method of forming metallic z-interconnects for laminate chip packages and boards | Brian E. Curcio, Donald S. Farquhar, Elizabeth Foster | 2003-10-21 |
| 6586683 | Printed circuit board with mixed metallurgy pads and method of fabrication | Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin Knadle, John J. Konrad +5 more | 2003-07-01 |
| 6581821 | Electronic package interconnect structure comprising lead-free solders | — | 2003-06-24 |
| 6545229 | Method for producing circuit board assemblies using surface mount components with finely spaced leads | Bao MA, Ping Kwong Seto | 2003-04-08 |