Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Donald S. Farquhar, Konstantinos I. Papathomas, Mark D. Poliks | 2003-11-11 |
| 6638607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock | 2003-10-28 |
| 6634543 | Method of forming metallic z-interconnects for laminate chip packages and boards | Donald S. Farquhar, Elizabeth Foster, Amit K. Sarkhel | 2003-10-21 |
| 6581280 | Method for filling high aspect ratio via holes in electronic substrates | Peter A. Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark D. Poliks | 2003-06-24 |
| 6570102 | Structure for high speed printed wiring boards with multiple differential impedance-controlled layer | Thomas R. Miller, Konstantinos I. Papathomas, Joseph J. Sniezek | 2003-05-27 |
| 6504111 | Solid via layer to layer interconnect | Donald S. Farquhar, Voya R. Markovich, Konstantinos I. Papathomas | 2003-01-07 |