Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656750 | Method for testing chips on flat solder bumps | Madhav Datta, Judith M. Rubino, Carlos J. Sambucetti, George F. Walker | 2003-12-02 |
| 6581280 | Method for filling high aspect ratio via holes in electronic substrates | Brian E. Curcio, Frederic Maurer, Konstantinos I. Papathomas, Mark D. Poliks | 2003-06-24 |
| 6566612 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, David Danovitch, Michael Liehr, Carlos J. Sambucetti | 2003-05-20 |
| 6534863 | Common ball-limiting metallurgy for I/O sites | George F. Walker, Ronald D. Goldblatt, Raymond R. Horton, Kevin S. Petrarca, Richard P. Volant +1 more | 2003-03-18 |
| 6527158 | Method and apparatus for forming solder bumps | Guy Paul Brouillette, Frederic Maurer | 2003-03-04 |