Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566612 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti | 2003-05-20 |
DD
David Danovitch
Overall (2003): #243,351 of 273,478Top 90%
1
Patents 2003