Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566612 | Method for direct chip attach by solder bumps and an underfill layer | David Danovitch, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti | 2003-05-20 |
| 6527158 | Method and apparatus for forming solder bumps | Peter A. Gruber, Frederic Maurer | 2003-03-04 |