Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661098 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Kevin S. Petrarca, Sampath Purushothaman, Richard P. Volant, George F. Walker | 2003-12-09 |
| 6656750 | Method for testing chips on flat solder bumps | Madhav Datta, Peter A. Gruber, Judith M. Rubino, George F. Walker | 2003-12-02 |
| 6646345 | Method for forming Co-W-P-Au films | Judith M. Rubino, Daniel C. Edelstein, Cyryl Cabral, Jr., George F. Walker, John G. Gaudiello +1 more | 2003-11-11 |
| 6573606 | Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect | Xiaomeng Chen, Soon-Cheon Seo, Birenda Nath Agarwala, Chao-Kun Hu, Naftali E. Lustig +1 more | 2003-06-03 |
| 6566612 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Michael Liehr | 2003-05-20 |
| 6503834 | Process to increase reliability CuBEOL structures | Xiaomeng Chen, Mahadevaiyer Krishnan, Judith M. Rubino, Soon-Cheon Seo, James A. Tornello | 2003-01-07 |