Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6573606 | Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect | Carlos J. Sambucetti, Xiaomeng Chen, Soon-Cheon Seo, Birenda Nath Agarwala, Naftali E. Lustig +1 more | 2003-06-03 |
| 6503641 | Interconnects with Ti-containing liners | Cyril Cabral, Jr., Roy A. Carruthers, James M. E. Harper, Kim Y. Lee, Ismail C. Noyan +2 more | 2003-01-07 |