Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6573606 | Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect | Carlos J. Sambucetti, Xiaomeng Chen, Birenda Nath Agarwala, Chao-Kun Hu, Naftali E. Lustig +1 more | 2003-06-03 |
| 6539625 | Chromium adhesion layer for copper vias in low-k technology | Brett H. Engel, Mark Hoinkis, John A. Miller, Yun-Yu Wang, Kwong Hon Wong | 2003-04-01 |
| 6503834 | Process to increase reliability CuBEOL structures | Xiaomeng Chen, Mahadevaiyer Krishnan, Judith M. Rubino, Carlos J. Sambucetti, James A. Tornello | 2003-01-07 |