Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6539625 | Chromium adhesion layer for copper vias in low-k technology | Brett H. Engel, John A. Miller, Soon-Cheon Seo, Yun-Yu Wang, Kwong Hon Wong | 2003-04-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6539625 | Chromium adhesion layer for copper vias in low-k technology | Brett H. Engel, John A. Miller, Soon-Cheon Seo, Yun-Yu Wang, Kwong Hon Wong | 2003-04-01 |