Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661097 | Ti liner for copper interconnect with low-k dielectric | Larry Clevenger, Stanley J. Klepeis, Hsiao-Ling Lu, Jeffrey R. Marino, Andrew H. Simon +2 more | 2003-12-09 |
| 6593660 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Leena Paivikki Buchwalter, Barbara Luther, Paul D. Agnello, John P. Hummel, Terence L. Kane +3 more | 2003-07-15 |
| 6539625 | Chromium adhesion layer for copper vias in low-k technology | Brett H. Engel, Mark Hoinkis, John A. Miller, Soon-Cheon Seo, Kwong Hon Wong | 2003-04-01 |
| 6509265 | Process for manufacturing a contact barrier | Patrick W. DeHaven, Anthony G. Domenicucci, Lynne M. Gignac, Glen L. Miles, Prabhat Tiwari +2 more | 2003-01-21 |