Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6593660 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Leena Paivikki Buchwalter, Barbara Luther, Paul D. Agnello, Terence L. Kane, Dirk Manger +3 more | 2003-07-15 |
| 6577011 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Leena Paivikki Buchwalter, Alessandro C. Callegari, Stephan A. Cohen, Teresita O. Graham, Christopher V. Jahnes +3 more | 2003-06-10 |
| 6551924 | Post metalization chem-mech polishing dielectric etch | Timothy J. Dalton | 2003-04-22 |