Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6593660 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Leena Paivikki Buchwalter, Paul D. Agnello, John P. Hummel, Terence L. Kane, Dirk Manger +3 more | 2003-07-15 |
| 6590290 | Stacked via in copper/polyimide BEOL | John Cronin | 2003-07-08 |