Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6593660 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Barbara Luther, Paul D. Agnello, John P. Hummel, Terence L. Kane, Dirk Manger +3 more | 2003-07-15 |
| 6577011 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Alessandro C. Callegari, Stephan A. Cohen, Teresita O. Graham, John P. Hummel, Christopher V. Jahnes +3 more | 2003-06-10 |