Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660330 | Method for depositing metal films onto substrate surfaces utilizing a chamfered ring support | Peter S. Locke, Sandra G. Malhotra, Fenton R. McFeely, John J. Yurkas | 2003-12-09 |
| 6661097 | Ti liner for copper interconnect with low-k dielectric | Larry Clevenger, Stanley J. Klepeis, Hsiao-Ling Lu, Jeffrey R. Marino, Yun-Yu Wang +2 more | 2003-12-09 |
| 6572982 | Electromigration-resistant copper microstructure | Cyprian Emeka Uzoh, Steven H. Boettcher, Patrick W. DeHaven, Christopher C. Parks | 2003-06-03 |
| 6569783 | Graded composition diffusion barriers for chip wiring applications | Cyprian Emeka Uzoh, Daniel C. Edelstein | 2003-05-27 |