Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6666959 | Semiconductor workpiece proximity plating methods and apparatus | Homayoun Talieh, Bulent M. Basol, Douglas W. Young | 2003-12-23 |
| 6649523 | Method and system to provide material removal and planarization employing a reactive pad | Bulent M. Basol, Homayoun Talieh | 2003-11-18 |
| 6630059 | Workpeice proximity plating apparatus | Homayoun Talieh, Bulent M. Basol, Douglas W. Young | 2003-10-07 |
| 6612915 | Work piece carrier head for plating and polishing | Boguslaw Nagorski, Konstantin Volodarsky, Douglas W. Young | 2003-09-02 |
| 6610190 | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate | Bulent M. Basol, Homayoun Talieh | 2003-08-26 |
| 6600230 | Seedlayer for plating metal in deep submicron structures | Peter S. Locke | 2003-07-29 |
| 6582579 | Methods for repairing defects on a semiconductor substrate | — | 2003-06-24 |
| 6572982 | Electromigration-resistant copper microstructure | Steven H. Boettcher, Patrick W. DeHaven, Christopher C. Parks, Andrew H. Simon | 2003-06-03 |
| 6569783 | Graded composition diffusion barriers for chip wiring applications | Daniel C. Edelstein, Andrew H. Simon | 2003-05-27 |