HL

Hsiao-Ling Lu

IBM: 1 patents #1,943 of 5,539Top 40%
Overall (2003): #208,718 of 273,478Top 80%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6661097 Ti liner for copper interconnect with low-k dielectric Larry Clevenger, Stanley J. Klepeis, Jeffrey R. Marino, Andrew H. Simon, Yun-Yu Wang +2 more 2003-12-09