Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661098 | High density area array solder microjoining interconnect structure and fabrication method | Kevin S. Petrarca, Sampath Purushothaman, Carlos J. Sambucetti, Richard P. Volant, George F. Walker | 2003-12-09 |
| 6657291 | Combined resistor-capacitor elements for decoupling in electronic packages | Albert E. Ruehli | 2003-12-02 |
| 6593644 | System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face | George Liang-Tai Chiu | 2003-07-15 |