Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661098 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Kevin S. Petrarca, Sampath Purushothaman, Carlos J. Sambucetti, Richard P. Volant | 2003-12-09 |
| 6656750 | Method for testing chips on flat solder bumps | Madhav Datta, Peter A. Gruber, Judith M. Rubino, Carlos J. Sambucetti | 2003-12-02 |
| 6646345 | Method for forming Co-W-P-Au films | Carlos J. Sambucetti, Judith M. Rubino, Daniel C. Edelstein, Cyryl Cabral, Jr., John G. Gaudiello +1 more | 2003-11-11 |
| 6551931 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Daniel C. Edelstein, Sung Kwon Kang, Maurice McGlashan-Powell, Eugene J. O'Sullivan | 2003-04-22 |
| 6534863 | Common ball-limiting metallurgy for I/O sites | Ronald D. Goldblatt, Peter A. Gruber, Raymond R. Horton, Kevin S. Petrarca, Richard P. Volant +1 more | 2003-03-18 |