Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566612 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Carlos J. Sambucetti | 2003-05-20 |
ML
Michael Liehr
Overall (2003): #156,278 of 273,478Top 60%
1
Patents 2003