Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6669833 | Process and apparatus for electroplating microscopic features uniformly across a large substrate | Suryanarayana Kaja, RongQing Yu | 2003-12-30 |
| 6640021 | Fabrication of a hybrid integrated circuit device including an optoelectronic chip | H. Bernhard Pogge, Roy Yu | 2003-10-28 |
| 6632314 | Method of making a lamination and surface planarization for multilayer thin film interconnect | RongQing Yu, Kimberley A. Kelly, Sung Kwon Kang, Sampath Purushothaman | 2003-10-14 |
| 6599778 | Chip and wafer integration process using vertical connections | H. Bernhard Pogge, Roy Yu, Chandrasekhar Narayan | 2003-07-29 |
| 6600224 | Thin film attachment to laminate using a dendritic interconnection | Donald S. Farquhar, Raymond T. Galasco, Sung Kwon Kang, Mark D. Poliks, Roy Yu | 2003-07-29 |