Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6640021 | Fabrication of a hybrid integrated circuit device including an optoelectronic chip | Roy Yu, Chandrika Prasad | 2003-10-28 |
| 6599778 | Chip and wafer integration process using vertical connections | Roy Yu, Chandrika Prasad, Chandrasekhar Narayan | 2003-07-29 |
| 6548325 | Wafer thickness compensation for interchip planarity | — | 2003-04-15 |