Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6570261 | Method and apparatus for injection molded flip chip encapsulation | Donald S. Farquhar, Michael Joseph Klodowski, Konstantinos I. Papathomas | 2003-05-27 |
| 6562654 | Tented plated through-holes and method for fabrication thereof | John S. Kresge, David B. Stone | 2003-05-13 |