Issued Patents 2003
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670223 | Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses | Eric A. Johnson | 2003-12-30 |
| 6661661 | Common heatsink for multiple chips and modules | Howard Victor Mahaney, Jr., Mark V. Pierson | 2003-12-09 |
| 6617698 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Nancy C. LaBianca, Stefano S. Oggioni, Son K. Tran | 2003-09-09 |
| 6576996 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson | 2003-06-10 |
| 6559666 | Method and device for semiconductor testing using electrically conductive adhesives | William E. Bernier, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik | 2003-05-06 |
| 6545869 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Barry A. Bonitz, Eric Duchesne, Eric A. Johnson | 2003-04-08 |
| 6545226 | Printed wiring board interposer sub-assembly | William L. Brodsky, Benson Chan, Voya R. Markovich | 2003-04-08 |
| 6531343 | Method of encapsulating a circuit assembly | Kenneth Raymond Carter, Craig J. Hawker, James L. Hedrick, Robert D. Miller, Stephen L. Buchwalter | 2003-03-11 |
| 6517662 | Process for making semiconductor chip assembly | Thomas M. Culnane, Ramesh R. Kodnani, Mark V. Pierson, Charles G. Woychik | 2003-02-11 |
| 6512295 | Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses | Eric A. Johnson | 2003-01-28 |