Issued Patents 2003
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664637 | Flip chip C4 extension structure and process | Miguel A. Jimarez, Cynthia S. Milkovich | 2003-12-16 |
| 6661661 | Common heatsink for multiple chips and modules | Michael A. Gaynes, Howard Victor Mahaney, Jr. | 2003-12-09 |
| 6639638 | LCD cover optical structure and method | Ramesh R. Kodnani, William J. Rudik, David B. Stone | 2003-10-28 |
| 6576996 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo | 2003-06-10 |
| 6569710 | Panel structure with plurality of chip compartments for providing high volume of chip modules | — | 2003-05-27 |
| 6559666 | Method and device for semiconductor testing using electrically conductive adhesives | William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Ajit K. Trivedi, Charles G. Woychik | 2003-05-06 |
| 6534848 | Electrical coupling of a stiffener to a chip carrier | Terry J. Dornbos, Raymond Phillips, William J. Rudik, David L. Thomas | 2003-03-18 |
| 6517662 | Process for making semiconductor chip assembly | Thomas M. Culnane, Michael A. Gaynes, Ramesh R. Kodnani, Charles G. Woychik | 2003-02-11 |
| 6516513 | Method of making a CTE compensated chip interposer | Cynthia S. Milkovich, Charles G. Woychik | 2003-02-11 |
| 6513701 | Method of making electrically conductive contacts on substrates | Donald I. Mead | 2003-02-04 |