WB

William E. Bernier

IBM: 3 patents #593 of 5,539Top 15%
📍 Endwell, NY: #3 of 38 inventorsTop 8%
🗺 New York: #836 of 9,423 inventorsTop 9%
Overall (2003): #19,466 of 273,478Top 8%
3
Patents 2003

Issued Patents 2003

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6585150 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder Donald W. Henderson, James Spalik, Isabelle Paquin 2003-07-01
6559666 Method and device for semiconductor testing using electrically conductive adhesives Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik 2003-05-06
6550667 Flux composition and soldering method for high density arrays Donald W. Henderson, James Spalik 2003-04-22