Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656313 | Structure and method for improved adhesion between two polymer films | Frank D. Egitto | 2003-12-02 |
| 6613184 | Stable interfaces between electrically conductive adhesives and metals | Frank D. Egitto, Paul Logan | 2003-09-02 |
| 6607613 | Solder ball with chemically and mechanically enhanced surface properties | Frank D. Egitto, Edmond O. Fey, David L. Questad, Rajinder S. Rai, Daniel C. Van Hart | 2003-08-19 |
| 6596559 | Flip-chip package with optimized encapsulant adhesion and method | Ramesh R. Kodnani, Son K. Tran | 2003-07-22 |
| 6576996 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Mark V. Pierson | 2003-06-10 |
| 6576549 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-06-10 |
| 6519845 | Wire bonding to dual metal covered pad surfaces | Lawrence R. Cutting, John G. Gaudiello, Nikhil M. Murdeshwar | 2003-02-18 |
| 6522014 | Fabrication of a metalized blind via | Frank D. Egitto, Elizabeth Foster, Raymond T. Galasco, David E. Houser, Mark L. Janecek +7 more | 2003-02-18 |