Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617698 | Reworkable and thermally conductive adhesive and use thereof | Stephen L. Buchwalter, Michael A. Gaynes, Nancy C. LaBianca, Stefano S. Oggioni | 2003-09-09 |
| 6596559 | Flip-chip package with optimized encapsulant adhesion and method | Ramesh R. Kodnani, Luis J. Matienzo | 2003-07-22 |
| 6558981 | Method for making an encapsulated semiconductor chip module | Miguel A. Jimarez, Marybeth Perrino, Tien Y. Wu | 2003-05-06 |