Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664637 | Flip chip C4 extension structure and process | Cynthia S. Milkovich, Mark V. Pierson | 2003-12-16 |
| 6639302 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries | Krishna Darbha, Matthew Reiss, Sanjeev Sathe, Charles G. Woychik | 2003-10-28 |
| 6583517 | Method and structure for joining two substrates with a low melt solder joint | — | 2003-06-24 |
| 6558981 | Method for making an encapsulated semiconductor chip module | Marybeth Perrino, Son K. Tran, Tien Y. Wu | 2003-05-06 |
| 6528179 | Reduction of chip carrier flexing during thermal cycling | Lisa J. Jimarez | 2003-03-04 |
| 6524888 | Method of attaching a conformal chip carrier to a flip chip | David N. Cokely, Thomas M. Culnane, Lisa J. Jimarez, Li Li, Donald I. Mead | 2003-02-25 |