Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649833 | Negative volume expansion lead-free electrical connection | David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel | 2003-11-18 |
| 6639302 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries | Miguel A. Jimarez, Matthew Reiss, Sanjeev Sathe, Charles G. Woychik | 2003-10-28 |
| 6631078 | Electronic package with thermally conductive standoff | David J. Alcoe, Varaprasad V. Calmidi, Sanjeev Sathe | 2003-10-07 |
| 6622786 | Heat sink structure with pyramidic and base-plate cut-outs | Varaprasad V. Calmidi, Sanjeev Sathe, Jamil A. Wakil | 2003-09-23 |
| 6528892 | Land grid array stiffener use with flexible chip carriers | David V. Caletka, William Infantolino, Eric A. Johnson | 2003-03-04 |