Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6665186 | Liquid metal thermal interface for an electronic module | Eric A. Johnson, Randall J. Stutzman | 2003-12-16 |
| 6665187 | Thermally enhanced lid for multichip modules | David J. Alcoe, William L. Brodsky, Sanjeev Sathe, Randall J. Stutzman | 2003-12-16 |
| 6631078 | Electronic package with thermally conductive standoff | David J. Alcoe, Krishna Darbha, Sanjeev Sathe | 2003-10-07 |
| 6622786 | Heat sink structure with pyramidic and base-plate cut-outs | Krishna Darbha, Sanjeev Sathe, Jamil A. Wakil | 2003-09-23 |