Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6665186 | Liquid metal thermal interface for an electronic module | Varaprasad V. Calmidi, Eric A. Johnson | 2003-12-16 |
| 6665187 | Thermally enhanced lid for multichip modules | David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Sanjeev Sathe | 2003-12-16 |
| 6655020 | Method of packaging a high performance chip | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, George H. Thiel | 2003-12-02 |
| 6552264 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, George H. Thiel | 2003-04-22 |
| 6552266 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, George H. Thiel | 2003-04-22 |
| 6541847 | Packaging for multi-processor shared-memory system | Harm Peter Hofstee, Eric A. Johnson, Jamil A. Wakil | 2003-04-01 |