Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667557 | Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections | Eric A. Johnson, Matthew Reiss, Charles G. Woychik | 2003-12-23 |
| 6665187 | Thermally enhanced lid for multichip modules | William L. Brodsky, Varaprasad V. Calmidi, Sanjeev Sathe, Randall J. Stutzman | 2003-12-16 |
| 6654250 | Low-stress compressive heatsink structure | — | 2003-11-25 |
| 6631078 | Electronic package with thermally conductive standoff | Varaprasad V. Calmidi, Krishna Darbha, Sanjeev Sathe | 2003-10-07 |
| 6583354 | Method of reforming reformable members of an electronic package and the resultant electronic package | — | 2003-06-24 |
| 6570259 | Apparatus to reduce thermal fatigue stress on flip chip solder connections | Eric A. Johnson, Matthew Reiss, Charles G. Woychik | 2003-05-27 |