Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6665187 | Thermally enhanced lid for multichip modules | David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Randall J. Stutzman | 2003-12-16 |
| 6639302 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries | Krishna Darbha, Miguel A. Jimarez, Matthew Reiss, Charles G. Woychik | 2003-10-28 |
| 6631078 | Electronic package with thermally conductive standoff | David J. Alcoe, Varaprasad V. Calmidi, Krishna Darbha | 2003-10-07 |
| 6627998 | Wafer scale thin film package | David V. Caletka, Seungbae Park | 2003-09-30 |
| 6622786 | Heat sink structure with pyramidic and base-plate cut-outs | Varaprasad V. Calmidi, Krishna Darbha, Jamil A. Wakil | 2003-09-23 |