Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649833 | Negative volume expansion lead-free electrical connection | Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel | 2003-11-18 |
| 6627998 | Wafer scale thin film package | Seungbae Park, Sanjeev Sathe | 2003-09-30 |
| 6603195 | Planarized plastic package modules for integrated circuits | James L. Carper, John P. Cincotta, Kibby B. Horsford, Gary H. Irish, John J. Lajza, Jr. +4 more | 2003-08-05 |
| 6595784 | Interposer member having apertures for relieving stress and increasing contact compliancy | William L. Brodsky | 2003-07-22 |
| 6541857 | Method of forming BGA interconnections having mixed solder profiles | Eric A. Johnson | 2003-04-01 |
| 6528892 | Land grid array stiffener use with flexible chip carriers | Krishna Darbha, William Infantolino, Eric A. Johnson | 2003-03-04 |
| 6507116 | Electronic package and method of forming | Eric A. Johnson | 2003-01-14 |