Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6655020 | Method of packaging a high performance chip | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, Randall J. Stutzman | 2003-12-02 |
| 6649833 | Negative volume expansion lead-free electrical connection | David V. Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman | 2003-11-18 |
| 6552264 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, Randall J. Stutzman | 2003-04-22 |
| 6552266 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, Randall J. Stutzman | 2003-04-22 |