Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6655020 | Method of packaging a high performance chip | Timothy F. Carden, Glenn O. Dearing, Stephen R. Engle, Randall J. Stutzman, George H. Thiel | 2003-12-02 |
| 6618938 | Interposer for semiconductor package assembly | Maniam Alagaratnam, Sunil A. Patel | 2003-09-16 |
| 6586825 | Dual chip in package with a wire bonded die mounted to a substrate | Sarathy Rajagopalan, Maniam Alagaratnam | 2003-07-01 |
| 6552264 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Stephen R. Engle, Randall J. Stutzman, George H. Thiel | 2003-04-22 |
| 6552266 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Stephen R. Engle, Randall J. Stutzman, George H. Thiel | 2003-04-22 |
| 6518161 | Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded die | Sarathy Rajagopalan | 2003-02-11 |