Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6586825 | Dual chip in package with a wire bonded die mounted to a substrate | Kishor Desai, Maniam Alagaratnam | 2003-07-01 |
| 6518161 | Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded die | Kishor Desai | 2003-02-11 |