Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6618938 | Interposer for semiconductor package assembly | Kishor Desai, Sunil A. Patel | 2003-09-16 |
| 6608376 | Integrated circuit package substrate with high density routing mechanism | Wee Liew, Aritharan Thurairajaratnam | 2003-08-19 |
| 6586825 | Dual chip in package with a wire bonded die mounted to a substrate | Sarathy Rajagopalan, Kishor Desai | 2003-07-01 |