Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6608376 | Integrated circuit package substrate with high density routing mechanism | Wee Liew, Maniam Alagaratnam | 2003-08-19 |
| 6566167 | PBGA electrical noise isolation of signal traces | Wee Liew, Nadeem HAQUE | 2003-05-20 |
| 6555914 | Integrated circuit package via | Pradip D. Patel, Manickam Thavarajah, Hong T. Lim | 2003-04-29 |
| 6534968 | Integrated circuit test vehicle | Leah M. Miller, Anand Govind, Zafer Kutlu, Chao-Wen Chung | 2003-03-18 |
| 6531932 | Microstrip package having optimized signal line impedance control | Anand Govind, Farshad Ghahghahi | 2003-03-11 |