Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6639321 | Balanced coefficient of thermal expansion for flip chip ball grid array | Kumar Nagarajan, Shirish Shah | 2003-10-28 |
| 6590292 | Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill | Ivor G. Barber | 2003-07-08 |
| 6534968 | Integrated circuit test vehicle | Leah M. Miller, Anand Govind, Chao-Wen Chung, Aritharan Thurairajaratnam | 2003-03-18 |