Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6639321 | Balanced coefficient of thermal expansion for flip chip ball grid array | Zafer Kutlu, Shirish Shah | 2003-10-28 |
| 6519844 | Overmold integrated circuit package | Seng-Sooi Lim, Chok J. Chia | 2003-02-18 |